Liquid crystal device and electronic apparatus

ABSTRACT

A liquid crystal device includes a positive potential connection line as a first connection line layer to which a first potential lower than a common potential is applied, between a pixel area and a seal member in the plan view, and a peripheral electrode as a second connection line layer that is provided between the positive potential connection line and a liquid crystal layer, is provided to overlap with at least a part of the positive potential connection line in the plan view, and to which a second potential higher than the common potential is applied.

BACKGROUND

1. Technical Field

The present invention relates to a liquid crystal device and anelectronic apparatus provided with the liquid crystal device.

2. Related Art

A liquid crystal device has a liquid crystal layer having a positive ornegative dielectric anisotropy interposed between a pair of substrates.For example, each electrode is formed on the pair of substrates, adriving voltage is applied between the electrodes with the liquidcrystal layer interposed therebetween to change an alignment state ofliquid crystal molecules constituting the liquid crystal layer by anelectric field effect, and thus it is possible to optically modulatelight input to the liquid crystal layer on the basis of an image signal.The liquid crystal layer has a thickness of, for example, several μm,and a high insulating property. However, when ionic impurities areincluded in the liquid crystal layer, the insulating property isdecreased in the whole liquid crystal layer or parts thereof, and thus,a desired driving voltage is not applied. Accordingly, a display defectsuch as display unevenness or burn-in may occur.

To improve the display defects caused by ionic impurities, for example,in JP-A-2002-196355, a liquid crystal display device provided with anionic impurity adsorption electrode on the outside of a display area ina seal member of one substrate of a pair of substrates is disclosed.

In JP-A-2002-196355, an example is disclosed, in which the ionicimpurity adsorption electrode is disposed on an active matrix substrateprovided with a plurality of pixel electrodes and thin film transistorsconnected to the pixel electrodes, respectively, a positive or negativedirect-current voltage with respect to a common voltage is applied, andionic impurities are adsorbed.

In addition, an example is disclosed, in which the ionic impurityadsorption electrode is electrically connected to a data signal line, ascanning signal line, or an auxiliary capacitance line.

On the outside of the display area of the active matrix substratedisclosed in JP-A-2002-196355, a potential-applied connection line maybe disposed in addition to a data signal line, a scanning signal line,and an auxiliary capacitance line. Accordingly, it is necessary toconsider a relative positional relationship between thepotential-applied connection line and the ionic impurity adsorptionelectrode. For example, when the potential-applied connection line iscloser to the pixel electrode than the ionic impurity adsorptionelectrode, it is thought that ionic impurities in liquid crystal areeccentrically located in the display area of attracting the ionicimpurities by an electric field generated between the connection lineand the pixel electrode, and the ionic impurities either cannot beadsorbed at all or cannot be adsorbed efficiently even when potential isapplied to the ionic impurity adsorption electrode. That is, even whenthe ionic impurity adsorption electrode is disposed on the outside ofthe display area of the active matrix substrate, there is a problem thatit may be difficult to obtain a desired effect.

SUMMARY

The invention can be realized in the following forms or applicationexamples.

APPLICATION EXAMPLE 1

According to Application Example 1, there is provided a liquid crystaldevice including: a first substrate that is provided with a pixel areawhere a plurality of pixel electrodes are arranged on one face sidethereof; a second substrate that is provided with a common electrode towhich a common potential is applied; a seal member that bonds the firstsubstrate and the second substrate; and a liquid crystal layer that iskept in an area surrounded by the seal member between the firstsubstrate and the second substrate, wherein the first substrate includesa first connection line layer that is provided between the base materialof the first substrate and the liquid crystal layer, which are betweenthe pixel area and the seal member in a plan view, and to which a firstpotential lower than the common potential is applied, and a secondconnection line layer that is provided between the first connection linelayer and the liquid crystal layer and is provided to overlap with atleast a part of the first connection line layer in the plan view, and towhich a second potential higher than the common potential is applied.

With such a configuration, a first electric field is generated betweenthe pixel electrodes and the first connection line layer to which thefirst potential lower than the common potential is applied. In addition,a second electric field is generated between the pixel electrodes andthe second connection line layer to which the second potential higherthan the common potential of the first substrate is applied. Thedirection of the second electric field with respect to the direction ofthe first electric field is a reverse direction, the second connectionline layer is provided to overlap with at least a part of the firstconnection line layer in the plan view, and thus the first electricfield generated between the first connection line layer and the pixelelectrode is weakened. Accordingly, the positive ionic impurities in theliquid crystal layer attracted by the first electric field generatedbetween the first connection line layer and the pixel electrodes arereversed by the second electric field generated between the secondconnection line layer and the pixel electrodes, and may be dispersed inthe liquid crystal layer. Accordingly, a display defect such as displayunevenness or burn-in caused by partial eccentric location of positiveionic impurities is reduced, and it is possible to provide the liquidcrystal device having high reliability with a stable display state kept.

APPLICATION EXAMPLE 2

According to Application Example 2, there is provided a liquid crystaldevice including: a first substrate that is provided with a pixel areawhere a plurality of pixel electrodes are arranged on one face sidethereof; a second substrate that is provided with a common electrode towhich a common potential is applied; a seal member that bonds the firstsubstrate and the second substrate; and a liquid crystal layer that iskept in an area surrounded by the seal member between the firstsubstrate and the second substrate, wherein the first substrate includesa first connection line layer that is provided between the base materialof the first substrate and the liquid crystal layer, which are betweenthe pixel area and the seal member in a plan view, and to which a firstpotential higher than the common potential is applied, and a secondconnection line layer that is provided between the first connection linelayer and the liquid crystal layer and is provided to overlap with atleast a part of the first connection line layer in the plan view, and towhich a second potential lower than the common potential is applied.

With such a configuration, a first electric field is generated betweenthe pixel electrodes and the first connection line layer to which thefirst potential higher than the common potential is applied. Inaddition, a second electric field is generated between the pixelelectrodes and the second connection line layer to which the secondpotential lower than the common potential of the first substrate isapplied. The direction of the second electric field with respect to thedirection of the first electric field is a reverse direction, the secondconnection line layer is provided to overlap with at least a part of thefirst connection line layer in the plan view, and thus the firstelectric field generated between the first connection line layer and thepixel electrode is weakened. Accordingly, the negative ionic impuritiesin the liquid crystal layer attracted by the first electric fieldgenerated between the first connection line layer and the pixelelectrodes are reversed by the second electric field generated betweenthe second connection line layer and the pixel electrodes, and may bedispersed in the liquid crystal layer. Accordingly, a display defectsuch as display unevenness or burn-in caused by partial eccentriclocation of negative ionic impurities is reduced, and it is possible toprovide the liquid crystal device having high reliability with a stabledisplay state kept.

APPLICATION EXAMPLE 3

In the liquid crystal device, the first substrate may includetransistors corresponding to the pixel electrodes, scanning lines thatare electrically connected to the transistors, and a scanning linedriving circuit that supplies a driving signal to the scanning lines,and the first connection line layer may be a positive potentialconnection line for supplying a positive potential to the scanning linedriving circuit.

With such a configuration, the positive potential connection line forsupplying the positive potential to the scanning line driving circuitmay be, for example, a connection line for supplying a reference fixedpotential lower than the common potential such as a GND potential, or aconnection line for supplying a driving fixed potential higher than thecommon potential. Positive or negative ionic impurities attracted by thefirst electric field between such a positive potential connection lineand the pixel electrode are reversed by the second electric fieldbetween the pixel electrode and the second connection line layer, andmay be dispersed in the liquid crystal.

APPLICATION EXAMPLE 4

In the liquid crystal device, the first substrate may include a thirdconnection line layer that is provided between the base material of thefirst substrate and the liquid crystal layer, is provided adjacent tothe pixel electrodes between the second connection line layer and thepixel electrodes in the plan view, and to which the common potential isapplied.

Alternating current potential with different polarities is applied tothe pixel electrodes with the common potential considered as areference, and on average, the potential is substantially the commonpotential. With such a configuration, the third connection line layer towhich the common potential is applied is provided between the secondconnection line layer and the pixel electrodes, and thus the intensityof the second electric field generated between the pixel electrodes andthe second connection line layer is increased as compared with a casewhere the third connection line layer is not provided. That is, it ispossible to more effectively disperse the positive or negative ionicimpurities which become a factor for causing display defects in theliquid crystal layer.

APPLICATION EXAMPLE 5

In the liquid crystal device, the third connection line layer may beprovided between the first connection line layer and the secondconnection line layer, and may be disposed to overlap with at least apart of an area of the first connection line layer which does notoverlap with the second connection line layer in the plan view.

With such a configuration, it is possible to block the first electricfield that extracts the positive or negative ionic impurities and isgenerated between the pixel electrodes and the first connection linelayer by the third connection line layer.

APPLICATION EXAMPLE 6

In the liquid crystal device, the second connection line layer mayoverlap to cover the first connection line layer in the plan view.

Even according to this application example, it is possible to reliablyblock the first electric field that extracts the positive or negativeionic impurities and is generated between the pixel electrodes and thefirst connection line layer by the second connection line layer.

APPLICATION EXAMPLE 7

In the liquid crystal device, the second connection line layer may beformed in the same connection line layer as the pixel electrode.

With such a configuration, the second connection line layer is formed inthe same layer as the pixel electrodes, and thus it is possible to raisethe intensity of the second electric field generated between the pixelelectrodes and the second connection line layer as compared with a casewhere it is not formed in the same layer.

APPLICATION EXAMPLE 8

In the liquid crystal device, the second connection line layer may bedisposed at a part along at least corner portions of the pixel area.

With such a configuration, it is possible to reduce the positive ornegative ionic impurities extracted to the first connection line layerside by ON-OFF of the liquid crystal layer from being eccentricallylocated at the corner portions of the pixel area.

APPLICATION EXAMPLE 9

In the liquid crystal device, the first substrate may include a fourthconnection line layer to which the common potential is applied, betweenthe second connection line layer and the pixel electrodes in the planview in the same layer as the pixel electrodes.

With such a configuration, it is possible to further raise the intensityof the second electric field generated between the pixel electrodes andthe second connection line layer. That is, it is possible to dispersethe positive or negative ionic impurities extracted to the firstconnection line layer side, in the liquid crystal.

APPLICATION EXAMPLE 10

In the liquid crystal device, the first substrate may include a fifthconnection line layer to which the common potential is applied, betweenthe second connection line layer and the seal member in the plan view inthe same layer as the pixel electrodes.

With such a configuration, a third electric field is generated betweenthe second connection line layer and the fifth connection line layer. Bythe third electric field, it is possible to reduce the positive ornegative ionic impurities included in the seal member from beingdiffused in the liquid crystal on the pixel area side.

APPLICATION EXAMPLE 11

In the liquid crystal device, the first substrate may include a fourthconnection line layer to which the common potential is applied, betweenthe second connection line layer and the pixel electrodes in the planview, and a fifth connection line layer to which the common potential isapplied, between the second connection line layer and the seal member inthe plan view.

With such a configuration, it is possible to disperse the positive ornegative ionic impurities extracted to the first connection line layerside, in the liquid crystal, and it is possible to reduce that thepositive or negative ionic impurities included in the seal member arediffused in the liquid crystal on the pixel area side. That is, it ispossible to provide the liquid crystal device in which the occurrence ofdisplay defects caused by the positive or negative ionic impurities isfurther reduced.

APPLICATION EXAMPLE 12

In the liquid crystal device, the second potential may be equal to orlower than a potential in which a ratio of change is 50% when a ratio ofchange of transmittance at the time of ON-OFF switching in the liquidcrystal layer is 100% considering the common potential as a referencepotential.

With such a configuration, even when the second potential is applied tothe second connection line layer, it is possible to avoid that thealignment of liquid crystal molecules in the liquid crystal layer isdisturbed by the electric field generated between the second connectionline layer and the pixel electrode or between the second connection linelayer and the common electrode, and, for example, the occurrence of adefect such as light leakage in a normally-black mode.

APPLICATION EXAMPLE 13

In the liquid crystal device, the second potential may be equal to orlower than a potential in which a ratio of change is 10% when a ratio ofchange of transmittance at the ON-OFF time in the liquid crystal layeris 100% considering the common potential as a reference potential.

With such a configuration, even when the second potential is applied tothe second connection line layer, it is possible to more reliably avoidthat the alignment of liquid crystal molecules in the liquid crystallayer is disturbed by the electric field generated between the secondconnection line layer and the pixel electrode or between the secondconnection line layer and the common electrode, for example, a defectsuch as light leakage in a normally-black mode occurs.

APPLICATION EXAMPLE 14

According to Application Example 13, there is provided a liquid crystaldevice including: a first substrate that is provided with a pixel areawhere a plurality of pixel electrodes are arranged on one face sidethereof; a second substrate that is provided with a common electrode towhich a common potential is applied; a seal member that bonds the firstsubstrate and the second substrate; and a liquid crystal layer that iskept in an area surrounded by the seal member between the firstsubstrate and the second substrate, wherein the first substrate includesa first connection line layer that is provided between the base materialof the first substrate and the liquid crystal layer, which are betweenthe pixel area and the seal member in a plan view, and to which a firstpotential lower than the common potential is applied, and a secondconnection line layer that is provided between the first connection linelayer and the liquid crystal layer and is provided to overlap with atleast a part of the first connection line layer in the plan view, and iselectrically connected to the first connection line layer.

With such a configuration, electric field reversing the negative ionicimpurities is generated with the pixel electrodes through the secondconnection line layer electrically connected to the first connectionline layer to which the first potential lower than the common potentialis applied. That is, it is not necessary to apply the potential lowerthan the common potential from the outside to the second connection linelayer, and it is possible to reduce the display defect caused by theeccentric location of the negative ionic impurities by applying thepotential to the second connection line layer using the first connectionline layer in the liquid crystal device.

APPLICATION EXAMPLE 15

According to Application Example 14, there is provided a liquid crystaldevice including: a first substrate that is provided with a pixel areawhere a plurality of pixel electrodes are arranged on one face sidethereof; a second substrate that is provided with a common electrode towhich a common potential is applied; a seal member that bonds the firstsubstrate and the second substrate; and a liquid crystal layer that iskept in an area surrounded by the seal member between the firstsubstrate and the second substrate, wherein the first substrate includesa first connection line layer that is provided between the base materialof the first substrate and the liquid crystal layer between the pixelarea and the seal member in the plan view, and to which a firstpotential higher than the common potential is applied, and a secondconnection line layer that is provided between the first connection linelayer and the liquid crystal layer and is provided to overlap with atleast a part of the first connection line layer in the plan view, and iselectrically connected to the first connection line layer.

With such a configuration, electric field reversing the positive ionicimpurities is generated with the pixel electrode through the secondconnection line layer electrically connected to the first connectionline layer to which the first potential higher than the common potentialis applied. That is, it is not necessary to apply the potential lowerthan the common potential from the outside to the second connection linelayer, and it is possible to reduce display defects caused by theeccentric location of the positive ionic impurities by applying thepotential to the second connection line layer using the first connectionline layer in the liquid crystal device.

APPLICATION EXAMPLE 16

In the liquid crystal device, the first substrate includes transistorscorresponding to the pixel electrodes, scanning lines that areelectrically connected to the transistors, and a scanning line drivingcircuit that supplies a driving signal to the scanning lines, and thefirst connection line layer is a positive potential connection line forsupplying a positive potential to the scanning line driving circuit.

With such a configuration, it is possible to apply the potential loweror higher than the common potential to the second connection line layerusing the positive potential connection line for supplying the referencepotential to the scanning line driving circuit or the positive potentialconnection line for supplying the driving potential.

APPLICATION EXAMPLE 17

According to Application Example 1, there is provided an electronicapparatus including the liquid crystal device according to theapplication examples.

With such a configuration, it is possible to provide the electronicapparatus in which display defects caused by the eccentric location ofthe positive or negative ionic impurities are reduced and which has highreliability.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1A is a schematic plan view illustrating a configuration of aliquid crystal device, and FIG. 1B is a schematic cross-sectional viewillustrating a structure of the liquid crystal device taken along theline IA-IA.

FIG. 2 is a circuit diagram illustrating an electrical configuration ofthe liquid crystal device.

FIG. 3 is an equivalent circuit diagram illustrating an electricalconfiguration of a pixel.

FIG. 4 is a schematic cross-sectional view illustrating a structure of apixel in the liquid crystal device.

FIG. 5 is a schematic plan view illustrating a relationship between anoblique deposition direction of an inorganic material and a displaydefect caused by ionic impurities.

FIG. 6 is a schematic plan view illustrating a planar position of aconnection line structure described in an example.

FIG. 7A is a schematic cross-sectional view illustrating a connectionline structure in an element substrate of Example 1, and FIG. 7B is aschematic cross-sectional view illustrating a modification example indisposition of a peripheral electrode and a connection line of Example1.

FIG. 8 is a V-T curve illustrating a relationship between a drivingvoltage and the transmittance of a pixel in the liquid crystal device.

FIG. 9 is a schematic cross-sectional view illustrating a connectionline structure of an element substrate of Example 2.

FIG. 10 is a schematic cross-sectional view illustrating a connectionline structure of an element substrate of Example 3.

FIG. 11 is a schematic cross-sectional view illustrating a connectionline structure of an element substrate of Example 4.

FIG. 12 is a schematic cross-sectional view illustrating a connectionline structure of an element substrate of Example 5.

FIG. 13 is a schematic cross-sectional view illustrating a connectionline structure of an element substrate of Example 6.

FIG. 14 is a schematic diagram illustrating a configuration of aprojection type display apparatus.

FIG. 15 is a schematic plan view illustrating disposition of aperipheral electrode of a modification example.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, embodiments of the invention will be described withreference to the drawings. In addition, the drawings used are shown byappropriate enlargement or contraction such that the described parts arerecognizable.

In addition, in the following embodiments, for example, a case of thedescription “on the substrate” means a case of disposition on thesubstrate so as to contact the substrate, a case of disposition on thesubstrate through another component, or a case of disposition with apart coming in contact on the substrate and disposition with a partthereof on the substrate through another component.

First Embodiment

In the embodiment, an active matrix type liquid crystal device providedwith thin film transistors as switching elements of pixels will bedescribed by way of example. The liquid crystal device may beappropriately used, for example, as an optical modulation element (aliquid crystal light valve) of a projection type display device (aliquid crystal projector) to be described later.

Liquid Crystal Device

First, a liquid crystal device of the embodiment will be described withreference to FIG. 1A to FIG. 3. FIG. 1A is a schematic plan viewillustrating a configuration of the liquid crystal device, FIG. 1B is aschematic cross-sectional view illustrating a structure of the liquidcrystal device taken along the line IB-IB of FIG. 1A, FIG. 2 is acircuit diagram illustrating an electrical configuration of the liquidcrystal device, FIG. 3 is an equivalent circuit diagram illustrating anelectrical configuration of a pixel, and FIG. 4 is a schematiccross-sectional view illustrating a structure of a pixel in the liquidcrystal device.

As shown in FIG. 1A and FIG. 1B, the liquid crystal device 100 of theembodiment includes an element substrate 10 as a first substrate and anopposed substrate 20 as a second substrate, which are opposed to eachother, and a liquid crystal layer 50 interposed between the pair ofsubstrates. In the element substrate 10 and the opposed substrate 20,for example, a quartz substrate or a glass substrate which istransparent is used as base materials 10 s and 20 s.

The element substrate 10 is larger than the opposed substrate 20, bothsubstrates are bonded through a seal member 40 disposed along an outerperiphery of the opposed substrate 20, and liquid crystal havingpositive or negative dielectric anisotropy at a space therebetween isenclosed to configure the liquid crystal layer 50. The seal member 40employs, for example, an adhesive such as thermosetting or ultravioletcurable epoxy resin. The seal member 40 is provided with a spacer (notshown) for keeping a gap between the pair of substrates regular.

The seal member 40 is provided therein with a pixel area E where aplurality of pixels P are arranged. In addition, a closeout portion 21surrounding the pixel area E is provided between the seal member 40 andthe pixel area E. The closeout portion 21 is formed of, for example, alight shielding metal or a metal oxide. In addition, the pixel area Emay include dummy pixels disposed to surround the plurality of pixels Pin addition to the plurality of pixels P contributing to display. Inaddition, although not shown in FIG. 1A and FIG. 1B, a light shieldingportion (a black matrix: BM) partitioning the plurality of pixels P inthe plan view in the pixel area E is provided on the opposed substrate20.

A data line driving circuit 101 is provided between the seal member 40along one side portion of the element substrate 10 and the one sideportion. In addition, an examination circuit 103 is provided between theseal member 40 along the other side portion opposed to the one sideportion and the pixel area E. In addition, scanning line drivingcircuits 102 are provided between the seal member 40 along other twoside portions perpendicular to the one side portion and opposed to eachother and the pixel area E. A plurality of connection lines 105connecting two scanning line driving circuit 102 are provided betweenthe seal member 40 along the other side portion opposed to the one sideand the examination circuit 103.

The connection lines connected to the data line driving circuit 101 andthe scanning line driving circuits 102 are connected to a plurality ofexternal connection terminals 104 arranged along the one side portion.Hereinafter, a direction along the one side portion is an X direction,and a direction along other two side portions perpendicular to the oneside portion and opposed to each other is a Y direction. In addition,disposition of the examination circuit 103 is not limited thereto, andthe examination circuit 103 may be provided between the seal member 40along the data line driving circuit 101 and the pixel area E.

As shown in FIG. 1B, on the surface on the liquid crystal layer 50 sideof the element substrate 10, the translucent pixel electrodes 15provided for each pixel P, thin film transistors (hereinafter, referredto as TFT) 30 that are switching elements, signal connection lines, andan alignment film 18 that covers them are formed. In addition, a lightshield structure of preventing light from being input to a semiconductorlayer in the TFT 30 such that a switching operation becomes unstable isemployed. The element substrate 10 as the first substrate in theinvention includes at least the base material 10 s, the pixel electrode15 formed on the base material 10 s, the TFT 30, the signal connectionline, and the alignment film 18.

On the surface on the liquid crystal layer 50 side of the opposedsubstrate 20, the closeout portion 21, a planarization layer 22 that isformed to cover it, the common electrode 23 that is provided to coverthe planarization layer 22, and the alignment film 24 that covers thecommon electrode 23 are provided. The opposed substrate 20 as the secondsubstrate in the invention includes at least the base material 20 s, thecloseout portion 21 that is formed on the base material 20 s, the commonelectrode 23, and the alignment film 24.

The closeout portion 21 surrounds the pixel area E as shown in FIG. 1A,and is provided at a position where the scanning line driving circuit102 and the examination circuit 103 are overlapped in the plan view.Accordingly, the light input from the opposed substrate 20 side to theperipheral circuit including such a driving circuit is shielded, and theperipheral circuit is prevented from being erroneously operated by thelight. In addition, unnecessary stray light is shielded so as not to beinput to the pixel area E, and a high contrast in display of the pixelarea E is secured.

The planarization layer 22 is formed of, for example, an inorganicmaterial such as silicon oxide, has optical transparency, and isprovided to cover the closeout portion 21. A method of forming such aplanarization layer 22 may be, for example, a method of forming a filmusing a plasma CVD method.

The common electrode 23 is formed of, for example, a transparentconductive film such as ITO (Indium Tin Oxide), covers the planarizationlayer 22, and is electrically connected to the connection line on theelement substrate 10 side through vertical electrical connectionportions 106 provided at four corners of the opposed substrate 20 asshown in FIG. 1A.

The alignment film 18 covering the pixel electrode 15 and the alignmentfilm 24 covering the common electrode 23 are selected on the basis ofoptical design of the liquid crystal device 100. For example, they maybe an organic alignment film formed of an organic material such aspolyimide by rubbing the surface thereof and performing a substantiallyhorizontal alignment process on liquid crystal molecules having positivedielectric anisotropy, or an inorganic alignment film formed of aninorganic material such as SiOx (silicon oxide) using a vapor-phasegrowth method by performing a substantially vertical alignment processon the liquid crystal molecules having negative dielectric anisotropy.In the embodiment, the inorganic alignment film described above isemployed as the alignment film 18 and the alignment film 24.

Such a liquid crystal device 100 is a transmission type, and employs anoptical design of a normally white mode of a bright display at thenon-driving time of the pixels P and a normally black mode of a darkdisplay at the non-driving time. A polarization element is disposed andused on the incident side and the output side of the light according tothe optical design. In the embodiment, the normally black mode isemployed.

Next, an electrical configuration of the liquid crystal device 100 willbe described with reference to FIG. 2 and FIG. 3.

As shown in FIG. 2, the liquid crystal device 100 includes drivingcircuits such as the data line driving circuit 101 formed in theperipheral area positioned around the pixel area E on the elementsubstrate 10, the scanning line driving circuit 102, and a samplingcircuit 70, and a plurality of external connection terminals 104. Inaddition, the liquid crystal device 100 has a plurality of pullingconnection lines including a data line driving circuit connection line114 for supplying power (VDDX, and VSSX) or a driving signal (DX, CLX,and the like) to the data line driving circuit 101, connected to theexternal connection terminal 104, a scanning line driving circuitconnection line 121 for supplying power (VDDY, and VSSY) or a drivingsignal (DY, CLY, and the like) to the scanning line driving circuit 102,a plurality of image signal lines 111 for supplying image signals (VID1to VID6) to the data line 6 a through the sampling circuit 70, and thelike.

An X clock signal CLX (and an inverse X clock signal CLX) and an X startpulse DX are supplied from the external circuit to the data line drivingcircuit 101 through the external connection terminal 104 and the dataline driving circuit connection line 114. When the X start pulse DX isinput, the data line driving circuit 101 sequentially generatesselection signals S1, S2, . . . , Sn at the timing based on the X clocksignal CLX (and the inverse X clock signal CLX), and outputs theselection signals to a plurality of selection signal supply lines 113.

A Y clock signal CLY (and an inverse Y clock signal CLY), and a Y startpulse signal DY are supplied from the external circuit to the scanningline driving circuit 102 through the external connection terminal 104and the scanning line driving circuit connection line 121. The scanningline driving circuit 102 sequentially generates scanning signals G1, G2,. . . , Gm on the basis of the signals, and outputs the scanning signalsto a plurality of scanning lines 3 a.

The sampling circuit 70 includes a plurality of sampling transistors(hereinafter, referred to as S-TFT) 71 configured by an N channel typesingle channel type TFT or a complementary type TFT. The gates of thesix S-TFTs 71 connected to six data lines 6 a adjacent to each other,respectively, may be collected to one, and are connected to oneselection signal supply line 113. That is, the selection signals S1, S2,. . . , Sn are supplied from the data line driving circuit 101, in whichsix S-TFT 71 are one unit (series). The sources of six S-TFT 71constituting one unit (series) are connected to any one of six imagesignal lines 111 through the connection line 112. A drain of the S-TFTs71 are connected to the data line 6 a. When the selection signals S1,S2, . . . , Sn are input, the sampling circuit 70 sequentially suppliesthe image signals (VID1 to VID6) according to the selection signals S1,S2, . . . , Sn to the data line 6 a corresponding to six S-TFT 71constituting one unit (series).

As shown in FIG. 2, the liquid crystal device 100 includes the pluralityof pixels arranged in matrix, in the pixel area E occupying a centerportion of the element substrate 10 as described above.

As shown in FIG. 3, each of the plurality of pixels P is provided withthe pixel electrode 15, the TFT 30 for switching control of the pixelelectrode 15, and a retentive capacitor 16. The data line 6 a to whichthe image signals (VID1 to VID6) are supplied is electrically connectedto the source of the TFT 30. The scanning line 3 a to which the scanningsignals G1, G2, . . . , Gm are supplied is connected to the gate of theTFT 30. One-side electrodes of the pixel electrode 15 and the retentivecapacitor 16 are connected to the drain of the TFT 30. The otherelectrode of the retentive capacitor 16 is connected to the capacitanceline 3 b disposed in parallel to the scanning line 3 a.

The capacitance line 3 b is drawn up to the outside of the pixel area Ein the X direction as shown in FIG. 2, and both ends of the capacitanceline 3 b are electrically connected to a pair of connection lines 131extending in the Y direction between the scanning line driving circuit102 and the pixel area E. Each of the pair of connection lines 131 iselectrically connected to a pair of connection lines 132 electricallyconnecting the vertical electrical connection portions 106 opposed inthe X direction among the four vertical electrical connection portions106 provided at the corner portions of the opposed substrate 20.

The pair of connection lines 132 are electrically connected to eachother through the common electrode 23 of the opposed substrate 20electrically connected to the vertical electric connection portion 106.In addition, the connection line 132 positioned on the externalconnection terminal 104 side of a pair of connection lines 132 isconnected to a pulling connection line 133 connected to the externalconnection terminal 104 to which the common potential (LCCOM) issupplied. That is, the common potential (LCCOM) is applied to thecapacitance line 3 b.

The selection signals S1, S2, . . . , Sn supplied to six S-TFT 71, whichare one unit (series), of the sampling circuit 70 may be sequentiallysupplied in this order, and may be supplied for each series with respectto the S-TFT 71 corresponding to six data lines 6 a adjacent to eachother. In addition, as shown in FIG. 2, in the embodiment, the selectionsignals S1, S2, . . . , Sn correspond to the image signals (VID1 toVID6) serial-parallel developed in six phases, and are supplied to eachgroup (the series) in the group of six data lines 6 a. The number ofphase evolutions (that is, the number of series of serial-parallelevoluted image signals) of the image signals (VID1 to VID6) is notlimited to six phases, for example, and image signals evoluted to aplurality of phases such as 9 phases, 12 phases, or 24 phases may besupplied to a group of data lines 6 a in which a number corresponding tothe number of evolutions is one group.

The scanning signals G1, G2, . . . , Gm are sequentially applied fromthe scanning line driving circuit 102 to the scanning line 3 a at apredetermined timing in pulse in this order. As described above, thepixel electrode 15 is electrically connected to the drain of the TFT 30,the TFT 30 is turned on during a predetermined period by the scanningsignals G1, G2, . . . , Gm, and the image signals (VID1 to VID6)supplied from the data lines 6 a are written in the pixel electrode 15at a predetermined timing.

In addition, to prevent the image signals (VID1 to VID6) kept in thepixels P from leaking, a retentive capacitor 16 is added in parallel tothe liquid crystal capacitance formed between the pixel electrode 15 andthe common electrode 23.

The image signals (VID1 to VID6) with a predetermined level written inthe liquid crystal layer 50 (see FIG. 1B) through the pixel electrodes15 are kept between the common electrodes 23 formed on the opposedsubstrate 20 during a predetermined period. In the liquid crystal layer50, alignment or order of liquid crystal molecules is changed accordingto the level of the applied voltage, the light passing through theliquid crystal layer 50 is modulated, and gradation display is possible.In the normally white mode, transmittance with respect to incident lightis decreased according to the voltage applied by a unit of each pixel Pto be a dark display. In the normally black mode, transmittance withrespect to incident light is increased according to the voltage appliedby a unit of each pixel P to be a bright display. Overall, display lighthaving a contrast corresponding to the image signals (VID1 to VID6) isemitted from the liquid crystal device 100 to perform display. Inaddition, the image signals (VID1 to VID6) are configured by combining apotential pulse having positive polarity and a potential pulse havingnegative polarity with respect to the common potential (LCCOM) to drivethe liquid crystal layer 50 in an alternating current manner. The methodof driving the liquid crystal device 100 described above is called aphase evolution driving method. In addition, the method of driving theliquid crystal device 100 is not limited to the phase evolution drivingmethod.

Returning to FIG. 2, in the element substrate 10, the peripheralelectrode 141 as the second connection line layer in the invention isprovided to surround the pixel area E in the vicinity of the connectionline 131 connected to the external connection terminal 104 to which thecommon potential (LCCOM) is supplied. The peripheral electrode 141 isconnected to each of a pair of pulling connection lines 142 extending inthe Y direction on both end sides in the X direction of the elementsubstrate 10. Each of the pair of pulling connection lines 142 isconnected to the external connection terminal 104 to which the secondpotential (CE) of the invention is supplied and is disposed between theexternal connection terminal 104 to which the common potential (LCCOM)is supplied and which is positioned on both end sides, and the externalconnection terminal 104 to which the driving potential (VDDY) as thefirst potential of the invention is supplied, in the plurality ofexternal connection terminals 104 arranged in the X direction. Detaileddisposition of the peripheral electrode 141 in the element substrate 10will be described in an example to be described later.

Next, a structure in the pixel P of the liquid crystal device 100, andparticularly, a detailed connection line structure of the elementsubstrate 10 and an alignment state of the liquid crystal molecules willbe described with reference to FIG. 4.

As shown in FIG. 4, first, the scanning line 3 a is formed on the basematerial 10 s of the element substrate 10.

The scanning line 3 a may be, for example, a metal elemental substanceincluding at least one metal Al (aluminum), Ti (titanium), Cr(chromium), W (tungsten), Ta (tantalum), and Mo (molybdenum), or thelike, an alloy, a metal silicide, a polysilicide, a nitride, or alaminated body thereof, and has a light shielding property.

For example, a first insulating film (a base insulating film) 11 aformed of silicon oxide is formed to cover the scanning line 3 a, and asemiconductor layer 30 a is formed on the first insulating film 11 a inan island shape. The semiconductor layer 30 a is formed of, for example,a polycrystalline silicon film, to which impurity ions are injected, andan LDD structure having a first source and drain area, a junction area,a channel area, a junction area, and a second source and drain area.

A second insulating film (a gate insulating film) 11 b is formed tocover to the semiconductor layer 30 a. In addition, a gate electrode 30g is formed at a position opposed to the channel area with the secondinsulating film 11 b interposed therebetween.

A third insulating film 11 c is formed to cover the gate electrode 30 gand the second insulating film 11 b, and two contact holes CNT1 and CNT2passing through the second insulating film 11 b and the third insulatingfilm 11 c are formed at a position overlapping with each end portion ofthe semiconductor layer 30 a.

A conductive film is formed using a conductive portion material with alight shielding property such as Al (aluminum) or alloy thereof to embedtwo contact holes CNT1 and CNT2 and to cover the third insulating film11 c, and is subjected to patterning, thereby forming a source electrode31 and the data line 6 a connected to the first source and drain areathrough the contact hole CNT1. Simultaneously, a drain electrode 32 (afirst relay electrode 6 b) connected to the second source and drain areais formed through the contact hole CNT2.

Then, the data line 6 a, the first relay electrode 6 b, and a firstinterlayer insulating film 12 to cover the third insulating film 11 care formed. The first interlayer insulating film 12 is formed of, forexample, an oxide or nitride of silicon, and is subjected to aplanarization process of planarizing unevenness on the surface caused bycovering the area where the TFT 30 is provided. A method of theplanarization process may be, for example, a chemical mechanicalpolishing (CMP) process, a spin coating process, or the like.

A contact hole CNT3 passing through the first interlayer insulating film12 is formed at a position overlapping with the first relay electrode 6b. A conductive film formed of metal with a light shielding propertysuch as Al (aluminum) or alloy thereof is formed to coat the contacthole CNT3 and to cover the first interlayer insulating film 12, issubjected to patterning, and thus a connection line 7 a and a secondrelay electrode 7 b electrically connected to the first relay electrode6 b through the contact hole CNT3 are formed.

The connection line 7 a is formed to overlap with the semiconductorlayer 30 a of the TFT 30 or the data line 6 a in the plan view, to whicha fixed potential is applied, and serves as a shield layer.

A second interlayer insulating film 13 a is formed to cover theconnection line 7 a and the second relay electrode 7 b. The secondinterlayer insulating film 13 a may be also formed of, for example,oxide or nitride of silicon, or oxynitride, and is subjected to aplanarization process such as the CMP process.

A contact hole CNT4 is formed at a position of the second interlayerinsulating film 13 a overlapping with the second relay electrode 7 b. Aconductive film formed of, for example, a metal with a light shieldingproperty such as Al (aluminum) or alloy thereof is formed to coat thecontact hole CNT4 and to cover the second interlayer insulating film 13a, and it is subjected to patterning, thereby forming a firstcapacitance electrode 16 a and a third relay electrode 16 d.

In the first capacitance electrode 16 a, an insulating film 13 b isformed by patterning to cover an outer edge at a position opposed to thesecond capacitance electrode 16 c through a dielectric layer 16 b to beformed later. In addition, in the third relay electrode 16 d, theinsulating film 13 b is formed by patterning to cover the outer edgeexcept for the part overlapping with the contact hole CNT5.

The dielectric layer 16 b is formed to cover the insulating film 13 band the first capacitance electrode 16 a. The dielectric layer 16 b maybe a monolayer film such as a silicon nitride film, a hafnium oxide(HfO₂) film, an alumina (Al₂O₂) film, or a tantalum oxide (Ta₂O₅) film,or a multilayer film formed by laminating at least two kinds of suchmonolayer films. The dielectric layer 16 b at the part overlapping withthe third relay electrode 16 d in the plan view is excluded by etchingor the like. For example, a conductive film such as TiN (titaniumnitride) film is formed to cover the dielectric layer 16 b, and it issubjected to patterning, thereby forming a second capacitance electrode16 c opposed to the first capacitance electrode 16 a and connected tothe third relay electrode 16 d. The retentive capacitor 16 is configuredby the dielectric layer 16 b, the first capacitance electrode 16 a andthe second capacitance electrode 16 c opposed with the dielectric layer16 b interposed therebetween.

Then, a third interlayer insulating film 14 is formed to cover thesecond capacitance electrode 16 c and the dielectric layer 16 b. Thethird interlayer insulating film 14 is also formed of, for example,oxide or nitride of silicon, and is subjected to a planarization processsuch as the CMP process. A contact hole CNT5 passing through the thirdinterlayer insulating film 14 is formed to reach a part where the secondcapacitance electrode 16 c comes in contact with the third relayelectrode 16 d.

A transparent conductive film (an electrode film) such as an ITO film isformed to coat the contact hole CNT5 and to cover the third interlayerinsulating film 14. The transparent conductive film (the electrode film)is subjected to patterning, and the pixel electrode 15 electricallyconnected to the second capacitance electrode 16 c and the third relayelectrode 16 d is formed through the contact hole CNT5.

The second capacitance electrode 16 c is electrically connected to thedrain electrode 32 of the TFT 30 through the third relay electrode 16 d,the contact hole CNT4, the second relay electrode 7 b, the contact holeCNT3, and the first relay electrode 6 b, and is electrically connectedto the pixel electrode 15 through the contact hole CNT5.

The first capacitance electrode 16 a is formed over the plurality ofpixels P, and serves as the capacitance line 3 b in the equivalentcircuit (see FIG. 3). Accordingly, the potential applied to the pixelelectrode 15 through the drain electrode 32 of the TFT 30 is keptbetween the first capacitance electrode 16 a and the second capacitanceelectrode 16 c.

As described above, the plurality of connection line layers are formedon the base material 10 s of the element substrate 10, and theconnection line layers are represented by reference numerals and signsof the insulating film for insulating between the connection line layersor the interlayer insulating film. That is, the first insulating film 11a, the second insulating film 11 b and the third insulating film 11 care called an enclosed connection line layer 11. A representativeconnection line of the connection line layer 11 is the gate electrode 30g. A representative connection line of the connection line layer 12 isthe data line 6 a. The second interlayer insulating film 13 a, theinsulating film 13 b and the dielectric layer 16 b are called anenclosed connection line layer 13, and a representative connection lineis the connection line 7 a. Similarly, a representative connection lineof the connection line layer 14 is the first capacitance electrode 16 a(the capacitance line 3 b).

The alignment film 18 is formed to cover the pixel electrode 15, and thealignment film 24 is formed to cover the common electrode 23 of theopposed substrate 20 opposed to the element substrate 10 with the liquidcrystal layer 50 interposed therebetween. As described above, thealignment films 18 and 24 are the inorganic alignment films, and areformed of a collected body of columns 18 a and 24 a grown by depositinginorganic materials such as silicon oxide in a predetermined direction,for example, oblique deposition, in a pillar shape. The liquid crystalmolecules LC having negative dielectric anisotropy with respect to suchalignment films 18 and 24 are substantially vertically aligned with apretilt angle θp of 3° to 5° in an oblique direction of the columns 18 aand 24 a with respect to the normal line direction of the alignment filmface. Alternating current potential is applied between the pixelelectrode 15 and the common electrode 23 to drive the liquid crystallayer 50, and thus the liquid crystal molecules LC are moved (vibrated)to be oblique in the direction of the electric field generated betweenthe pixel electrode 15 and the common electrode 23.

FIG. 5 is a schematic plan view illustrating a relationship between theoblique deposition direction of the inorganic material and the displaydefects caused by the ionic impurities. As shown in FIG. 5, the obliquedeposition direction of the inorganic material in the forming of thecolumns 18 a and 24 a is a direction intersecting the Y direction at apredetermined orientation angle θa from the upper right to the lowerleft as indicated by the broken line arrow, for example, on the elementsubstrate 10 side. On the opposed substrate 20 side opposed to theelement substrate 10, the direction is a direction intersecting the Ydirection at the predetermined orientation angle θa from the lower leftto the upper right as indicated by the solid line arrow. Thepredetermined angle θa is, for example, 45°. In addition, the obliquedeposition direction shown in FIG. 5 is a direction when viewing theliquid crystal device 100 on the opposed substrate 20 side.

By driving the liquid crystal layer 50, movement (the vibration) of theliquid crystal molecules LC occurs and flow of the liquid crystalmolecules LC occurs in the oblique deposition direction indicated by thebroken line or solid line shown in FIG. 5 in the vicinity of aninterface between the liquid crystal layer 50 and the alignment films 18and 24. If positive or negative ionic impurities are included in theliquid crystal layer 50, the ionic impurities are guided to the cornerportions of the pixel area E according to the flow of the liquid crystalmolecules LC and may be eccentrically located. When insulatingresistance of the liquid crystal layer 50 is decreased with respect tothe pixels P positioned at the corner portions by the eccentric locationof the ionic impurities, the driving potential is decreased with respectto the pixel P, and the display unevenness shown in FIG. 5 or a burn-inphenomenon caused by electric connection significantly occurs.

In the liquid crystal device 100 of the embodiment, direct currentpotential is applied to the peripheral electrode 141 as the secondconnection line layer of the element substrate 10 shown in FIG. 2 toimprove the eccentric location of the positive or negative ionicimpurities which is a factor for causing display unevenness or burn-inphenomenon. As described above, the element substrate 10 has a pluralityof connection line layers, and various connection lines to which apredetermined potential is applied are present in the peripheral areabetween the seal member 40 and the pixel area E. To sufficiently exhibitthe function of the peripheral electrode 141, it is necessary to make itdifficult to receive the influence of the potential of the otherconnection line, and it is necessary to optimize the relativedisposition between the peripheral electrode 141 and the otherconnection line. Hereinafter, an example based on the connection linestructure of the element substrate 10 of the embodiment will bedescribed.

FIG. 6 is a schematic plan view illustrating a planar position of theconnection line structure shown in the example. As shown in FIG. 6, thepixel area E includes a display area E1 where the pixels P contributingto display are arranged in the X direction and the Y direction, and adummy pixel area E2 where a plurality of dummy pixels P surrounding thedisplay area E1 are disposed. An area between the seal member 40surrounding to the pixel area E and the pixel area E is called aperipheral area E3. Hereinafter, in the examples, as shown in FIG. 6, aschematic cross-sectional view of the liquid crystal device 100 cut bythe line VI-VI from the left side of the seal member 40 surrounding theperipheral area E3 to the pixels P positioned at the lower left cornerportion of the display area E1 is shown and described. In the connectionline structure of the element substrate 10 at the portion of theperipheral area E3 along the left side of the seal member 40, theconnection line structure of the element substrate 10 at the portion ofthe peripheral area E3 along the right side of the seal member 40 is astructure symmetric basically with respect to the X direction. Inaddition, in FIG. 6, at the portion of the peripheral area E3 along theupper side of the pixel area E and the portion of the peripheral area E3along the lower side of the pixel area E, the connection line forsupplying the reference potential (VSS) lower than the common potential(LCCOM) of the first connection line layer in the invention forsupplying the positive potential to the scanning line driving circuit102 is not disposed. The connection line with a potential equal to thecommon potential (LCCOM) or higher than the common potential (LCCOM) isdisposed. In the embodiment, the positive potential connection line is aconnection line for supplying the driving potential (VDDY) or thereference potential (VSSY) as power to the last stage of a buffercircuit of the scanning line driving circuit 102.

In the power (the positive potential) supplied to the scanning linedriving circuit 102 in the liquid crystal device 100 of the embodiment,for example, the driving potential (VDDY) is 15.5 v, and the referencepotential (VSSY) is 0 v (GND). The common potential (LCCOM) applied tothe capacitance line 3 b or the common electrode 23 of the opposedsubstrate 20 is, for example, 6 v. A rectangular alternating potentialin the range of ±5 v in which the common potential (LCCOM) is areference is applied to the pixel electrode 15 in the pixel P fordisplay, corresponding to a frame based on a driving frequency,according to a gradation degree of the image signal.

In the connection line structure of the element substrate 10 in thefollowing examples, “the same layer” means a connection line formed withthe same film thickness using the same connection line material in thesame connection line layer. In the case of the same connection linelayer, it is possible to simultaneously form connection lines withdifferent connection destinations by, for example, photolithography. Inaddition, the connection lines are not limited to simultaneous forming,and may be formed at the different times.

EXAMPLE 1

FIG. 7A is a schematic cross-sectional view illustrating a connectionline structure in an element substrate of Example 1, and FIG. 7B is aschematic cross-sectional view illustrating a modification example indisposition of a peripheral electrode and a connection line of Example1.

As shown in FIG. 7A, in Example 1, in the connection line layer 12 ofthe peripheral area E3, a scanning line driving circuit connection line121 s (hereinafter, referred to as a positive potential connection line121 s) to which the reference potential (VSSY) is supplied (applied),and a scanning line driving circuit connection line 121 d to(hereinafter, referred to as a positive potential connection line 121 d)to which the driving potential (VDDY) is supplied (applied) aredisposed. A connection line 131 for supplying (applying) the commonpotential (LCCOM) to the connection line layer 13 between the positivepotential connection line 121 s and the dummy pixel area E2 is disposed.In the same layer as the pixel electrode 15, the peripheral electrode141 is disposed at the position overlapping with the positive potentialconnection line 121 s of the connection line layer 12. In Example 1, anexample of the first connection line layer in the invention is thepositive potential connection lines 121 s and 121 d, an example of thesecond connection line layer in the invention is the peripheralelectrode 141, and an example of the third connection line layer in theinvention is the connection line 131.

FIG. 8 is a V-T curve illustrating a relationship between the drivingvoltage and the transmittance of the pixel in the liquid crystal device.For example, in the case of normally black, the alternating currentpotential based on the image signal is applied to the pixel electrode 15of the display area E1 as described above, and the transmittance of thepixel P is changed in the range of 0% to 100% represented by the V-Tcurve shown in FIG. 8. When the liquid crystal device 100 is driven, apotential with transmittance to an extent that light leakage does notoccur, for example, equal to or lower than potential V50 withtransmittance of 50% or lower, preferably, equal to or lower than V10with transmittance of 10% or lower is applied to the pixel electrode 15of the dummy pixel area E2, irrespective of the ON-OFF state of theliquid crystal layer 50. Specifically, the V50 is ±2.5 v in which thecommon potential (LCCOM: 6 v) is reference, and the V10 is about ±1 v inwhich the common electrode (LCCOM: 6 v) is reference.

First, a case where the peripheral electrode 141 of Example 1 is notprovided will be described. In the peripheral area E3, the positivepotential connection line 121 s is disposed between the positivepotential connection line 121 d and the connection line 131, in whichthe reference potential (VSSY) is lower than the connection line 131 towhich the common potential (LCCOM) is applied and the referencepotential is supplied to the positive potential connection line 121 s,and thus the first electric field from the pixel electrode 15 of thedummy pixel area E2 with a potential higher than the positive potentialconnection line 121 s to the positive potential connection line 121 s isgenerated. When the positive ionic impurities are included in the liquidcrystal layer 50, the positive ionic impurities may be attracted to thepositive potential connection line 121 s with the potential (0 v) lowerthan the potential of the connection line 131 (the common potential; 6v). Accordingly, the display unevenness caused by the eccentric locationof the ionic impurities shown in FIG. 5 easily occurs. In addition, thenegative ionic impurities are not led to the positive potentialconnection line 121 s but are reversed to the display area E1 side bythe influence of the first electric field between the positive potentialconnection line 121 s and the pixel electrode 15.

Meanwhile, in Example 1, for example, a +7 v direct current potential asthe second potential higher than the common electrode (LCCOM: 6 v) isapplied to the peripheral electrode 141 provided in the same layer asthe pixel electrode 15. As indicated by the solid line arrow shown inFIG. 7A, the second electric field from the peripheral electrode 141 tothe pixel electrode 15 and from the peripheral electrode 141 to thecommon electrode 23 is generated. The second electric field has adirection reverse to the first electric field described above, and mayreverse the positive ionic impurities which can be attracted by thefirst electric field, to the display area E1 side to disperse thepositive ionic impurities in the liquid crystal layer 50. That is, it ispossible to reduce the display unevenness caused by eccentric locationof the positive ionic impurities at the corner portions of the pixelarea E. Meanwhile, the negative ionic impurities are attracted andadsorbed to the peripheral electrode 141 stronger than the positivepotential connection line 121 s. Even when the negative ionic impuritiesare adsorbed to the peripheral electrode 141 and have an influence onthe alignment of the liquid crystal molecules, the peripheral area E3 isoptically shielded by the closeout portion 21 as shown in FIG. 1, andthus the display unevenness caused by the eccentric location of thenegative ionic impurities is invisible.

The disposition of the positive potential connection lines 121 s and 121d as the first connection line layer in Example 1 and the potentialapplied to the peripheral electrode 141 are not limited thereto. Forexample, as shown in parentheses in FIG. 7A, the positions of thepositive potential connection lines 121 s and 121 d may be changed, andthe positive potential connection line 121 d to which the drivingpotential (VDDY) is applied may be disposed between the positivepotential connection line 121 s and the connection line 131. In thiscase, in the peripheral area E3, the positive potential connection line121 d is disposed between the positive potential connection line 121 sand the connection line 131, in which the positive potential connectionline 121 d to which the driving potential (VDDY) is supplied is higherthan the connection line 131 to which the common potential (LCCOM) isapplied, and thus the first electric field from the positive potentialconnection line 121 d to the pixel electrode 15 of the dummy pixel areaE2 with a potential lower than the positive potential connection line121 d is generated. When the negative ionic impurities are included inthe liquid crystal layer 50, the negative ionic impurities may beattracted to the positive potential connection line 121 d with thepotential (15.5 v) higher than the connection line 131 (the commonpotential: 6 v). Accordingly, the peripheral electrode 141 is providedto overlap with the positive potential connection line 121 d in the planview in the same layer as the pixel electrode 15, and for example, a +5v direction current potential as the second potential lower than thecommon potential (LCCOM: 6 v) is applied to the peripheral electrode141. Then, as indicated by the broken arrow of FIG. 7A, the secondelectric field from the pixel electrode 15 to the peripheral electrode141 and from the common electrode 23 to the peripheral electrode 141 isgenerated. Accordingly, the negative ionic impurities attracted in thefirst electric field between the positive potential connection line 121d and the pixel electrode 15 may be reversed to the display area E1 sideto disperse the negative ionic impurities in the liquid crystal layer50. That is, it is possible to reduce the display unevenness caused byeccentric location of the negative ionic impurities at the cornerportions of the pixel area E. Meanwhile, the positive ionic impuritiesare attracted and adsorbed to the peripheral electrode 141 stronger thanthe positive potential connection line 121 d. Even when the positiveionic impurities are adsorbed to the peripheral electrode 141 and havean influence on the alignment of the liquid crystal molecules, theperipheral area E3 is optically shielded by the closeout portion 21 asshown in FIG. 1, and thus the display unevenness caused by the eccentriclocation of the positive ionic impurities is invisible.

It is thought that the ionic impurities are included in materialsconstituting the liquid crystal device 100, or infiltrate in the processof manufacturing the liquid crystal device 100 from other members orchemicals. Accordingly, the ionic impurities included in the liquidcrystal layer 50 may include those representing both positive andnegative polarities, but there are few cases where the amounts ofpositive and negative ionic impurities are the same. By analyzing aproduct representing the display unevenness or burn-in phenomenon shownin FIG. 5, it is possible to investigate the polarity of the ionicimpurities included in the liquid crystal layer 50. According to thepolarity of dominant ionic impurities, when the peripheral electrode 141is disposed and the corresponding direct current potential is applied asdescribed in Example 1, it is possible to reduce the display unevennessor burn-in phenomenon caused by the eccentric location of the dominantionic impurities.

The magnitude of the second potential applied to the peripheralelectrode 141 is a potential equal to or lower than V50 with respect tothe common potential (LCCOM: 6 v), preferably a potential equal to orlower than V10, such that the alignment state of the liquid crystalmolecules in the dummy pixel area E2 is disturbed and a defect such aslight leakage does not occur.

In addition, as shown in FIG. 7B, when the positive potential connectionline 121 s (the positive potential connection line 121 d) provided inthe connection line layer 12 and the connection line 131 provided in theconnection line layer 13 are overlapped in the plan view, it ispreferable to dispose the peripheral electrode 141 to overlap with thepart of the positive potential connection line 121 s (the positivepotential connection line 121 d) which does not overlap with theconnection line 131. In other words, when there is an area which is notcovered with the peripheral electrode 141 in the positive potentialconnection line 121 s (the positive potential connection line 121 d), itis preferable to dispose the connection line 131 to overlap with atleast a part of the area of the positive potential connection line 121 s(the positive potential connection line 121 d) which does not overlapwith the peripheral electrode 141 in the plan view. Accordingly, thefirst electric field generated between the potential connection line 121s (the positive potential connection line 121 d) and the pixel electrode15 is blocked by the connection line 131 as the third connection linelayer, and it is possible to reduce that the positive or negative ionicimpurities are attracted to the positive potential connection line 121(the positive potential connection line 121 d).

EXAMPLE 2

FIG. 9 is a schematic cross-sectional view illustrating a connectionline structure in an element substrate of Example 2 shown in FIG. 9. InExample 2, a range where the peripheral electrode 141 is provided isdifferent from that of Example 1. Specifically, as shown in FIG. 9, theperipheral electrode 141 of Example 2 is formed in the same layer as thepixel electrode 15 such that the positive potential connection lines 121s and 121 d provided in the connection line layer 12 overlaps with theconnection line 131 provided in the connection line layer 13 in the planview.

According to Example 2, the first electric field generated between thepositive potential connection lines 121 s and 121 d and the pixelelectrode 15 is blocked, and it is possible to raise the intensity ofthe second electric field generated between the peripheral electrode 141and the pixel electrode 15. By the direct current potential applied tothe peripheral electrode 141, one of the positive or negative ionicimpurities is reversed and dispersed in the liquid crystal layer 50, andthe others are adsorbed to the peripheral electrode 141 with an areabroader than that of Example 1. That is, it is possible to furtherreduce the display unevenness or burn-in phenomenon caused by theeccentric location of the positive or negative ionic impurities at thecorner portions of the pixel area E.

The disposition of the positive potential connection lines 121 s and 121d in Example 2 is not limited thereto, and the position may be changedto dispose the connection lines as described in Example 1. The directcurrent potential applied to the peripheral electrode 141 is the same asExample 1, and the direct current potential according to the polarity ofthe ionic impurities dominantly included in the liquid crystal layer 50is applied.

The peripheral electrode 141 may overlap with the positive potentialconnection lines 121 s and 121 d as the first connection line layer inthe plan view, and may not overlap with all the connection lines 131 towhich the common potential (LCCOM) is applied.

EXAMPLE 3

FIG. 10 is a schematic cross-sectional view illustrating a connectionline structure in an element substrate of Example 3. As shown in FIG.10, in Example 3, in the same layer as the pixel electrode 15, a secondperipheral electrode 151 to which the common electrode (LCCOM: 6 v) isapplied is provided between the peripheral electrode 141 and the pixelelectrode 15 of the dummy pixel area E2 differently from Example 1.

According to Example 3, the second peripheral electrode 151 to which thedirect current common potential (LCCOM: 6 v) is applied is disposedbetween the peripheral electrode 141 to which a direct current potentialhigher than or lower than the common potential (LCCOM: 6 v) is applied,and the pixel electrode 15 of the dummy pixel area E2 to whichalternating current potential is applied in which the common potential(LCCOM: 6 v) is reference, and thus it is possible to raise theintensity of the second electric field generated (indicated by the solidline or the broken line) between the peripheral electrode 141 and thepixel electrode 15.

In addition, when the positive or negative ionic impurities are adsorbedto the peripheral electrode 141, the electrode to which the directcurrent potential is applied is parallel by disposing the secondperipheral electrode 151 between the pixel electrodes 15, and it isdifficult to diffuse the ionic impurities adsorbed to the peripheralelectrode 141 to the pixel electrode 15 side.

The planar disposition of the second peripheral electrode 151 may bedisposition between the peripheral electrode 141 and the pixel area E tosurround the pixel area E, may be linear disposition to overlap with theconnection line 131 in the plan view along the left side and the rightside of the pixel area E in FIG. 6 considering an occurrence situationof the display unevenness shown in FIG. 5. A method of applying thecommon potential (LCCOM) to the second peripheral electrode 151 may be amethod of providing a contact hole at a position overlapping with theconnection line 132 extending in the X direction shown in FIG. 2 andelectrically connecting the second peripheral electrode 151 and theconnection line 132.

EXAMPLE 4

FIG. 11 is a schematic cross-sectional view illustrating a connectionline structure of an element substrate of Example 4. As shown in FIG.11, in Example 4, a third peripheral electrode 152 to which the commonpotential (LCCOM: 6 v) is applied is further provided between theperipheral electrode 141 and the seal member 40 differently from Example3.

There is a worry that the seal member 40 may include ionic impuritiessuch as a small amount of metal ions or uncured materials in the processof manufacturing the seal member 40 or the liquid crystal device 100.

According to Example 4, the third peripheral electrode 152 to which thecommon potential is applied is disposed between the seal member 40 andthe peripheral electrode 141 in the peripheral area E3. In addition, thethird peripheral electrode 152 is disposed to overlap with the positivepotential connection line 121 d (the positive potential connection line121 s) as the first connection line layer in the plan view.

Accordingly, the third electric field is generated between theperipheral electrode 141 to which the direct current potential higher orlower than the common potential (LCCOM: 6 v), and the third peripheralelectrode 152 to which the common potential (LCCOM: 6 v) is applied. Bythe direction of the third electric field indicated by the solid line orthe broken line, it is possible to reduce that the positive or negativeionic impurities to be diffused from the seal member 40 into the liquidcrystal layer 50 are reversed to the seal member 40 side to be diffusedto the display area E1 side.

That is, in Example 4, it is possible to improve the display defectcaused by the ionic impurities included in the seal member 40 as well asthe ionic impurities included in the liquid crystal layer 50.

EXAMPLE 5

FIG. 12 is a schematic cross-sectional view illustrating a connectionline structure of an element substrate of Example 5. As shown in FIG.12, in Example 5, on the base material 10 s of the element substrate 10,a peripheral electrode 161 as the second connection line layer is formedin the connection line layer 14 between the positive potentialconnection lines 121 d and 121 s as the first connection line layer andthe pixel electrode 15. The peripheral electrode 161 is electricallyconnected to the positive potential connection line 121 s to which thereference potential (VSSY: 0 v) is applied, through a relay electrode134 formed in connection line layer 13 of the lower layer. In addition,the positive potential connection lines 121 d and 121 s as the firstconnection line layer and the connection line 131 as the thirdconnection line layer are disposed to overlap in the plan view. Inaddition, the peripheral electrode 161 is formed in the connection linelayer 14 to surround the pixel area E in the plan view similarly to theperipheral electrode 141 of Example 1. In addition, it may be disposedto overlap with the positive potential connection lines 121 d and 121 sas at least the first connection line layer in the plan view, and maynot overlap with the whole of the connection line 131.

According to Example 5, as indicated by the broken line arrow shown inFIG. 12, the electric field from the pixel electrode 15 to theperipheral electrode 161 is generated between the peripheral electrode161 and the pixel electrode 15 of the dummy pixel area E2. In addition,the electric field from the common electrode 23 to the peripheralelectrode 161 is generated between the peripheral electrode 161 and thecommon electrode 23. When the electric field is the fourth electricfield, the positive ionic impurities included in the liquid crystallayer 50 may be attracted to the peripheral electrode 161 by the fourthelectric field, and the negative ionic impurities are reversed. Theintensity of the fourth electric field is determined by the material andfilm thickness of the third interlayer insulating film 14 between theperipheral electrode 161 and the liquid crystal layer 50. For example,when the film thickness is about 600 nm in which the third interlayerinsulating film 14 is a laminated film of NSG and BSG, the directcurrent potential on the surface coming in contact with the liquidcrystal layer 50 of the connection line layer 14 provided with theperipheral electrode 161 may be about ±1 v.

That is, even when the peripheral electrode 141 is not provided in thesame layer as the pixel electrode 15 as described in Example 1, it ispossible to obtain the same effect as that of the peripheral electrode141. In addition, in the case of the peripheral electrode 141, thepotential lower than the common potential (LCCOM) is applied from theoutside through the external connection terminal 104. However, inExample 5, it is possible to apply the potential lower than the commonpotential (LCCOM) to the peripheral electrode 161 using the potential ofthe positive potential connection line 121 s for supplying the power(the positive potential) to the scanning line driving circuit 102 in theliquid crystal device 100. That is, the potential may not be suppliedfrom the outside, and thus it is possible to effectively use it withoutincreasing the external connection terminal 104.

EXAMPLE 6

FIG. 13 is a schematic cross-sectional view illustrating a connectionline structure of an element substrate of Example 6. As shown in FIG.13, in Example 6, the first connection line layer electrically connectedto the peripheral electrode 161 as the second connection line layer inExample 5 is the positive potential connection line 121 d to which thedriving potential (VDDY) is supplied.

On the base material 10 s of the element substrate 10, a peripheralelectrode 161 is formed in the connection line layer 14 between thepositive potential connection lines 121 s and 121 d as the firstconnection line layer and the pixel electrode 15. The peripheralelectrode 161 is electrically connected to the positive potentialconnection line 121 d to which the driving potential (VDDY: 15.5 v) isapplied, through a relay electrode 134 formed in connection line layer13 of the lower layer. In addition, the positive potential connectionlines 121 s and 121 d as the first connection line layer and theconnection line 131 as the third connection line layer are disposed tooverlap in the plan view. The peripheral electrode 161 is formed in theconnection line layer 14 to surround the pixel area E in the plan viewsimilarly to the peripheral electrode 141 of Example 1. In addition, itmay be disposed to overlap with the positive potential connection lines121 s and 121 d as at least the first connection line layer in the planview, and may not overlap with the whole of the connection line 131.

According to Example 6, as indicated by the solid line arrow shown inFIG. 13, the electric field from the peripheral electrode 161 to thepixel electrode 15 is generated between the peripheral electrode 161 andthe pixel electrode 15 of the dummy pixel area E2. In addition, theelectric field from the peripheral electrode 161 to the common electrode23 is generated between the peripheral electrode 161 and the commonelectrode 23. When the electric field is the fifth electric field, thenegative ionic impurities included in the liquid crystal layer 50 may beattracted to the peripheral electrode 161 by the fifth electric field,and the positive ionic impurities are reversed. The intensity of thefifth electric field is determined by the material and film thickness ofthe third interlayer insulating film 14 between the peripheral electrode161 and the liquid crystal layer 50. For example, when the filmthickness is about 600 nm in which the third interlayer insulating film14 is a laminated film of NSG and BSG, the direct current potential onthe surface coming in contact with the liquid crystal layer 50 of theconnection line layer 14 provided with the peripheral electrode 161 maybe about ±14.5 v.

That is, even when the peripheral electrode 141 is not provided in thesame layer as the pixel electrode 15 as described in Example 1, it ispossible to obtain the same effect as that of the peripheral electrode141. In addition, in the case of the peripheral electrode 141, thepotential higher than the common potential (LCCOM) is applied from theoutside through the external connection terminal 104. However, inExample 6, it is possible to apply the potential higher than the commonpotential (LCCOM) to the peripheral electrode 161 using the potential ofthe positive potential connection line 121 d for supplying the power(the positive potential) to the scanning line driving circuit 102 in theliquid crystal device 100. That is, the potential may not be suppliedfrom the outside, and thus it is possible to effectively use it withoutincreasing the external connection terminal 104.

As described above, in the liquid crystal device 100 of the embodiment,as described in Example 1 to Example 6, in the peripheral area E3 of thepixel area E, the peripheral electrode 141 (the peripheral electrode161) is disposed considering the disposition of the positive potentialconnection lines 121 s and 121 d for supplying the power (the positivepotential) to the last stage of the buffer circuit of the scanning linedriving circuit 102 or the connection line 131 to which the commonpotential (LCCOM) is applied. By applying the direct current potentialto the peripheral electrode 141 (the peripheral electrode 161), it ispossible to reduce the display unevenness or burn-in phenomenon causedby the eccentric location of the ionic impurities included in the liquidcrystal layer 50 or the seal member 40 at the corner portions of thepixel area E.

Second Embodiment

Electronic Apparatus

Next, a projection type display apparatus as an electronic apparatus ofthe embodiment will be described with reference to FIG. 14. FIG. 14 is aschematic diagram illustrating a configuration of the projection typedisplay apparatus.

As shown in FIG. 14, the projection type display apparatus 1000 as theelectronic apparatus of the embodiment includes a polarizationillumination device 1100 that is disposed along a system optical axis L,two dichroic mirrors 1104 and 1105 as optical separation elements, threereflection mirrors 1106, 1107, and 1108, five relay lenses 1201, 1202,1203, 1204, and 1205, three projection type liquid crystal light valves1210, 1220, and 1230 as optical modulation means, a cross-dichroic prism1206 as an optical synthetic element, and a projection lens 1207.

The polarization illumination device 1100 schematically includes a lampunit 1101 as a light source that is formed of a white light source suchas an ultrahigh pressure mercury or halogen lamp, an integrator lens1102, and a polarization conversion element 1103.

The dichroic mirror 1104 reflects red light (R) of the polarizationlight flux emitted from the polarization illumination device 1100, andallows green light (G) and blue light (B) to pass. In addition, onedichroic mirror 1105 reflects the green light (G) passing through thedichroic mirror 1104, and allows the blue light (B) to pass.

The red light (R) reflected by the dichroic mirror 1104 is reflected bythe reflection mirror 1106, and then is input to the liquid crystallight valve 1210 through the relay lens 1205.

The green light (G) reflected by the dichroic mirror 1105 is input tothe liquid crystal light valve 1220 through the relay lens 1204.

The blue light (B) passing through the dichroic mirror 1105 is input tothe liquid crystal light valve 1230 through a light guide system formedof three relay lenses 1201, 1202, and 1203 and two reflection mirrors1107 and 1108.

The liquid crystal light valves 1210, 1220, and 1230 are opposed toincident faces of color light of the cross-dichroic prism 1206,respectively. The color light input to the liquid crystal light valves1210, 1220, and 1230 is modulated on the basis of video information(video signals), and is emitted to the cross-dichroic prism 1206.

The prism is formed by bonding four rectangular prisms, in which adielectric multilayer film reflecting the red light and a dielectricmultilayer film reflecting the blue light are formed on an inner facethereof in a cross-shape. Three colors of light are synthesized by suchdielectric multilayer films, and the beams of light representing colorimages are synthesized. The synthesized light is projected onto thescreen 1300 by the projection lens 1207 that is the projection opticalsystem, and the image is enlarged and displayed.

The liquid crystal device 100 described above is applied to the liquidcrystal light valve 1210. The liquid crystal device 100 is disposed witha gap between a pair of polarization elements disposed in a cross manneron the incident side and the emission side of the color light. The sameis applied to the other liquid crystal light valves 1220 and 1230.

According to such a projection type display apparatus 1000, the liquidcrystal device 100 in which the display unevenness or burn-in phenomenoncaused by the ionic impurities is reduced is used as the liquid crystallight valves 1210, 1220, and 1230, and thus satisfactory display qualityand high reliability are realized.

The invention is not limited to the embodiments described above, and maybe appropriately modified within the scope which does not deviate fromthe main concept or sprit of the invention understood from Claims or theentire specification, and a liquid crystal device 100 with suchmodification and an electronic apparatus to which the liquid crystaldevice 100 is applied are included in the technical scope of theinvention. In addition to the embodiments described above, variousmodification examples are conceivable. Hereinafter, the modificationexamples will be described.

MODIFICATION EXAMPLE 1

The peripheral electrode 141 (the peripheral electrode 161) as thesecond connection line layer in the liquid crystal device 100 is notlimited to disposition to surrounding the pixel area E. FIG. 15 is aschematic plan view illustrating disposition of peripheral electrodes ofthe modification example. As shown in FIG. 15, by generation of flowbased on movement of liquid crystal molecules, corresponding to thecorner portions positioned at the diagonal of the pixel area E where theionic impurities are easily eccentrically located, a pair of peripheralelectrode 141A and peripheral electrode 141B may be disposed at theparts taken along the corner portions. In addition, the peripheralelectrodes 141A and 141B may be formed in the same layer as the pixelelectrode 15 similarly to Example 1 to Example 4, and may be formed inthe connection line layer 14 to be electrically connected to the firstconnection line layer similarly to Example 5 and Example 6.

MODIFICATION EXAMPLE 2

In Example 4 of the liquid crystal device 100, the second peripheralelectrode 151, the peripheral electrode 141, and the third peripheralelectrode 152 are disposed adjacent to one another from the pixel area Eside, between the seal member 40 and the pixel area E in the same layeras the pixel electrode 15. When the display unevenness or burn-inphenomenon shown in FIG. 5 is caused mainly by the ionic impuritiesincluded in the seal member 40, a configuration of eliminating thesecond peripheral electrode 151 of Example 4 may be employed.

MODIFICATION EXAMPLE 3

The alignment process in the liquid crystal device 100 is not limited tothe VA (Vertical Alignment) method. For example, even using a TN(Twisted Nematic) method or an OCB (Optically Compensated Bend) method,it is possible to improve the display defect caused by the ionicimpurities by applying the peripheral electrode 141 (the peripheralelectrode 161).

MODIFICATION EXAMPLE 4

The liquid crystal device 100 to which the peripheral electrode 141 (theperipheral electrode 161) is applied is not limited to the projectiontype. The invention may be also applied to a reflection type liquidcrystal device in which the pixel electrode 15 has light reflectivity.

MODIFICATION EXAMPLE 5

The electronic apparatuses to which the liquid crystal device 100 isapplicable are not limited to the projection type display apparatus 1000of the embodiment. For example, the liquid crystal device 100 may beappropriately used as a projection type HUD (a head-up display) or adirect-view type HMD (a head mount display), or a display unit of aninformation terminal apparatus such as an electronic book, a personalcomputer, a digital camera, a liquid crystal TV, a view finder type ormonitor direct-view type video recorder, a car navigation system, anelectronic diary, and a POS.

This application claims priority from Japanese Patent Application No.2011-254706 filed in the Japanese Patent Office on Nov. 22, 2011, theentire disclosure of which is hereby incorporated by reference in itsentirely.

What is claimed is:
 1. A liquid crystal device comprising: a firstsubstrate that is provided with a pixel area where a plurality of pixelelectrodes are arranged on one face side thereof; a second substratethat is provided with a common electrode to which a common potential isapplied; a seal member that bonds the first substrate and the secondsubstrate; and a liquid crystal layer that is kept in an area surroundedby the seal member between the first substrate and the second substrate,wherein the first substrate includes a base material, a first connectionline that is provided between the base material and the liquid crystallayer, which are between the pixel area and the seal member in a planview, and the first connection line is configure to be applied a firstpotential lower than the common potential, a second connection line thatis provided between the first connection line and the liquid crystallayer and is provided to overlap with at least a part of the firstconnection line in the plan view, and the second connection line isconfigured to be applied a second potential higher than the commonpotential, and a third connection line that is provided between the basematerial and the liquid crystal layer, is provided adjacent to the pixelelectrodes between the second connection line and the pixel electrodesin the plan view, and to which the common potential is applied.
 2. Aliquid crystal device comprising: a first substrate that is providedwith a pixel area where a plurality of pixel electrodes are arranged onone face side thereof; a second substrate that is provided with a commonelectrode to which a common potential is applied; a seal member thatbonds the first substrate and the second substrate; and a liquid crystallayer that is kept in an area surrounded by the seal member between thefirst substrate and the second substrate, wherein the first substrateincludes a base material, a first connection line that is providedbetween the base material and the liquid crystal layer, which arebetween the pixel area and the seal member in a plan view, and to whicha first potential higher than the common potential is applied, a secondconnection line that is provided between the first connection line andthe liquid crystal layer and is provided to overlap with at least a partof the first connection line in the plan view, and to which a secondpotential lower than the common potential is applied, and a thirdconnection line that is provided between the base material and theliquid crystal layer, is provided adjacent to the pixel electrodesbetween the second connection line and the pixel electrodes in the planview, and to which the common potential is applied.
 3. The liquidcrystal device according to claim 1, wherein the first substrateincludes transistors corresponding to the pixel electrodes, scanninglines that are electrically connected to the transistors, and a scanningline driving circuit that supplies a driving signal to the scanninglines, and wherein the first connection line is a positive potentialconnection line for supplying a positive potential to the scanning linedriving circuit.
 4. The liquid crystal device according to claim 1,wherein the third connection line is provided between the firstconnection line and the second connection line, and is disposed tooverlap with at least a part of an area of the first connection linewhich does not overlap with the second connection line in the plan view.5. The liquid crystal device according to claim 1, wherein the secondconnection line is overlapped to cover the first connection line in theplan view.
 6. The liquid crystal device according to claim 1, whereinthe second connection line is formed in a same layer as the pixelelectrode.
 7. The liquid crystal device according to claim 6, whereinthe second connection line is disposed at a part along at least cornerportions of the pixel area.
 8. A liquid crystal device comprising: afirst substrate that is provided with a pixel area where a plurality ofpixel electrodes are arranged on one face side thereof; a secondsubstrate that is provided with a common electrode to which a commonpotential is applied; a seal member that bonds the first substrate andthe second substrate; and a liquid crystal layer that is kept in an areasurrounded by the seal member between the first substrate and the secondsubstrate, wherein the first substrate includes a base material, a firstconnection line that is provided between the base material and theliquid crystal layer, which are between the pixel area and the sealmember in a plan view, and the first connection line is configure to beapplied a first potential lower than the common potential, a secondconnection line that is provided between the first connection line andthe liquid crystal layer, is provided to overlap with at least a part ofthe first connection line in the plan view, is formed in a same layer asthe pixel electrode, and the second connection line is configured to beapplied a second potential higher than the common potential, and afourth connection line to which the common potential is applied, betweenthe second connection line and the pixel electrode in the plan view inthe same layer as the pixel electrodes.
 9. A liquid crystal devicecomprising: a first substrate that is provided with a pixel area where aplurality of pixel electrodes are arranged on one face side thereof; asecond substrate that is provided with a common electrode to which acommon potential is applied; a seal member that bonds the firstsubstrate and the second substrate; and a liquid crystal layer that iskept in an area surrounded by the seal member between the firstsubstrate and the second substrate, wherein the first substrate includesa base material, a first connection line that is provided between thebase material and the liquid crystal layer, which are between the pixelarea and the seal member in a plan view, and the first connection lineis configure to be applied a first potential lower than the commonpotential, a second connection line that is provided between the firstconnection line and the liquid crystal layer, is provided to overlapwith at least a part of the first connection line in the plan view, isformed in a same layer as the pixel electrode, and the second connectionline is configured to be applied a second potential higher than thecommon potential, and a fifth connection line to which the commonpotential is applied, between the second connection line and the sealmember in the plan view in the same layer as the pixel electrodes.
 10. Aliquid crystal device comprising: a first substrate that is providedwith a pixel area where a plurality of pixel electrodes are arranged onone face side thereof; a second substrate that is provided with a commonelectrode to which a common potential is applied; a seal member thatbonds the first substrate and the second substrate; and a liquid crystallayer that is kept in an area surrounded by the seal member between thefirst substrate and the second substrate, wherein the first substrateincludes a base material, a first connection line that is providedbetween the base material and the liquid crystal layer, which arebetween the pixel area and the seal member in a plan view, and the firstconnection line is configure to be applied a first potential lower thanthe common potential, a second connection line that is provided betweenthe first connection line and the liquid crystal layer, is provided tooverlap with at least a part of the first connection line in the planview, is formed in a same layer as the pixel electrode, and the secondconnection line is configured to be applied a second potential higherthan the common potential, and a fourth connection line to which thecommon potential is applied, between the second connection line and thepixel electrode in the plan view, and a fifth connection line to whichthe common potential is applied, between the second connection line andthe seal member in the plan view, in the same layer as the pixelelectrodes.
 11. The liquid crystal device according to claim 1, whereinthe second potential is equal to or lower than a potential in which aratio of change is 50% when a ratio of change of transmittance at theON-OFF time in the liquid crystal layer is 100% considering the commonpotential as a reference potential.
 12. The liquid crystal deviceaccording to claim 1, wherein the second potential is equal to or lowerthan a potential in which a ratio of change is 10% when a ratio ofchange of transmittance at the ON-OFF time in the liquid crystal layeris 100% considering the common potential as a reference potential.
 13. Aliquid crystal device comprising: a first substrate that is providedwith a pixel area where a plurality of pixel electrodes are arranged onone face side thereof; a second substrate that is provided with a commonelectrode to which a common potential is applied; a seal member thatbonds the first substrate and the second substrate; and a liquid crystallayer that is kept in an area surrounded by the seal member between thefirst substrate and the second substrate, wherein the first substrateincludes a first connection line that is provided between the basematerial of the first substrate and the liquid crystal layer, which arebetween the pixel area and the seal member in a plan view, and to whicha first potential lower than the common potential is applied, a secondconnection line that is provided between the first connection line andthe liquid crystal layer and is provided to overlap with at least a partof the first connection line in the plan view, and is electricallyconnected to the first connection line, and a third connection line thatis provided between the base material and the liquid crystal layer, isprovided adjacent to the pixel electrodes between the second connectionline and the pixel electrodes in the plan view, and to which the commonpotential is applied.
 14. The liquid crystal device according to claim13, wherein the first substrate includes transistors corresponding tothe pixel electrodes, scanning lines that are electrically connected tothe transistors, and a scanning line driving circuit that supplies adriving signal to the scanning lines, and the first connection line is apositive potential connection line for supplying a positive potential tothe scanning line driving circuit.
 15. An electronic apparatuscomprising the liquid crystal device according to claim
 1. 16. Anelectronic apparatus comprising the liquid crystal device according toclaim
 2. 17. An electronic apparatus comprising the liquid crystaldevice according to claim
 3. 18. An electronic apparatus comprising theliquid crystal device according to claim 4.